Reexam Supercritical Fluid CO2 Application Device
You can dry nano-level fine structures without breaking them!
Supercritical processing is a method for extracting three-dimensional structures, such as those processed by wet etching in MEMS, which are extremely fine and fragile. These structures can be deformed or destroyed by the surface tension that occurs at the liquid interface during natural drying or IPA drying. In a sealed chamber, supercritical CO2 is injected into wafers or similar items that are in a liquid immersion state with IPA, allowing for the discharge of IPA while maintaining a state without surface tension at the IPA interface, thus drying them without damage.
- Company：レクザム 香川工場
- Price：10 million yen-50 million yen
